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LED encapsulation die bonding insulating glue

HP-E304 is the latest generation of advanced anti-yellowing, single-component encapsulant designed for LED chip bonding using silicone-modified epoxy resin.

Semiconductor sintered silver

The HP-K039 series is a single-component, low-temperature sintering nano-conductive adhesive with ultra-high electrical and thermal conductivity; it can operate normally at low-temperature sintering and high-temperature (600℃) environments.

Conductive adhesive for semiconductor packaging

The HP-020 series is a series of conductive adhesives with excellent weather resistance and thermal conductivity, and a long working time, using thermosetting polymers as the binder.

Mercury series integrated circuit material solutions

Conductive silver paste for modules: HP-L102-L

Silver paste for internal electrodes of multilayer inductors: HP-2080G

Black epoxy underfill for semiconductor components: HP-E204

Conductive adhesive for LED packaging: HP-G030A

Conductive adhesive for IC packaging: HP-020 series

Jupiter Series High-Efficiency Innovative Material Solutions

IME Conductive Silver Paste: HP-I1412

Automotive LiDAR Silver Paste: HP-K039

Electromagnetic Shielding Silver Paste: HP-X0201Z

Filter Silver Paste: HP-1501A

5G Antenna Conductive Silver Paste: HP-L103

Optical Grade Thermosetting Insulating Ink: HP-1301

High-temperature sintering silver paste for the "quick heating" module

High-temperature sintering silver paste for "instant heating" module: HP-A917

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lv@hyperionchina.com

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+86-18676698904

Enterprise Location

1338, Floor 12, Building 1, Yard 2, Boxing 9th Road, Beijing Economic and Technological Development Zone, Beijing

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