LED encapsulation die bonding insulating glue
Classification:
Key words:
LED encapsulation die bonding insulating glue
Product Details
Product Overview
HP-E304 is the latest generation of advanced, anti-yellowing, single-component encapsulant designed for LED chip die bonding using silicone-modified epoxy resin. It features excellent optical properties, ultra-long stable working life, fast curing ability, excellent anti-light decay ability, and excellent wire bonding temperature stability, which can greatly improve product yield. Its suitable rheological properties make it suitable for syringe dispensing, molding, and needle dispensing processes.
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Project |
Performance Parameters |
Test Methods |
| Basic Parameters |
Appearance |
Transparent fluid |
Visual inspection |
| Viscosity |
12000mPa.s |
VT-Brookfield CP51@5rpm, 25℃ |
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| Curing Conditions |
120℃/30 min |
Oven |
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| Performance Parameters |
Tensile Strength |
9MPa |
@25℃ |
| Tensile Elongation at Break |
4% |
@25℃ |
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| Coefficient of Thermal Expansion |
92ppm/K |
20-120℃ |
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| Thermal Conductivity |
0.1w/m.k |
@25℃ |
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| Breakdown Voltage |
16KV/mm |
@25℃ |
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1338, Floor 12, Building 1, Yard 2, Boxing 9th Road, Beijing Economic and Technological Development Zone, Beijing
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