Conductive adhesive for semiconductor packaging
Classification:
Key words:
Conductive adhesive for semiconductor packaging
Product Details
Product Overview
The HP-020 series is a series of conductive adhesives with excellent weather resistance and thermal conductivity, and a long working time, using thermosetting polymers as the binder. Suitable for conductive bonding of hardware products such as IC packaging, it requires low-temperature storage and is processed using dispensing.
| Model |
HP-020A |
HP-020D |
HP-020E |
HP-020B |
HP-020F |
HP-020C |
| Appearance |
Silver Gray |
Silver Gray |
Silver Gray |
Silver Gray |
Silver Gray |
Silver Gray |
| Viscosity (cps) |
9000 |
9000 |
11000 |
9000 |
15000 |
16000 |
| Thixotropy Index |
4.5 |
5.6 |
5.0 |
4.6 |
3.0 |
5.4 |
| Thermal Conductivity (W/mK) |
2.1 |
2.6 |
2.6 |
2.7 |
2.0 |
2.1 |
| Volume Resistivity (Ω.cm) |
1.0×10 -4 |
1.0×10 -4 |
5.0×10 -3 |
1.0×10 -4 |
1.0×10 -4 |
8.0×10 -5 |
| Working Time |
24h |
24h |
24h |
24h |
24h |
24h |
| Curing Conditions (175℃) |
1h |
1h |
2h @150℃ |
15min |
1h |
1h |
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