Mercury series integrated circuit material solutions
Conductive silver paste for modules: HP-L102-L
Silver paste for internal electrodes of multilayer inductors: HP-2080G
Black epoxy underfill for semiconductor components: HP-E204
Conductive adhesive for LED packaging: HP-G030A
Conductive adhesive for IC packaging: HP-020 series
Jupiter Series High-Efficiency Innovative Material Solutions
IME Conductive Silver Paste: HP-I1412
Automotive LiDAR Silver Paste: HP-K039
Electromagnetic Shielding Silver Paste: HP-X0201Z
Filter Silver Paste: HP-1501A
5G Antenna Conductive Silver Paste: HP-L103
Optical Grade Thermosetting Insulating Ink: HP-1301
High-temperature sintering silver paste for the "quick heating" module