Mercury series integrated circuit material solutions

Conductive silver paste for modules: HP-L102-L

Silver paste for internal electrodes of multilayer inductors: HP-2080G

Black epoxy underfill for semiconductor components: HP-E204

Conductive adhesive for LED packaging: HP-G030A

Conductive adhesive for IC packaging: HP-020 series

Jupiter Series High-Efficiency Innovative Material Solutions

IME Conductive Silver Paste: HP-I1412

Automotive LiDAR Silver Paste: HP-K039

Electromagnetic Shielding Silver Paste: HP-X0201Z

Filter Silver Paste: HP-1501A

5G Antenna Conductive Silver Paste: HP-L103

Optical Grade Thermosetting Insulating Ink: HP-1301

High-temperature sintering silver paste for the "quick heating" module

High-temperature sintering silver paste for "instant heating" module: HP-A917
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