Mercury series integrated circuit material solutions
Classification:
Conductive silver paste for modules: HP-L102-L
Silver paste for internal electrodes of multilayer inductors: HP-2080G
Black epoxy underfill for semiconductor components: HP-E204
Conductive adhesive for LED packaging: HP-G030A
Conductive adhesive for IC packaging: HP-020 series
Key words:
Mercury series integrated circuit material solutions
Product Details
|
Model |
Product Type |
Process |
Features |
|
HP-L102 |
Conductive Silver Paste for Modules |
Dispensing |
1. Low-temperature curing 2. Suitable for high-speed dispensing equipment 3. Good adhesion to metals, chips, etc. |
|
HP-2080G |
Silver Paste for Internal Electrodes of Multilayer Inductors |
Screen Printing |
1. Low resistance, strong adhesion, good acid resistance 2. Suitable for manufacturing fine and thick conductive films |
|
HP-E204 |
Epoxy Black Underfill for Semiconductor Devices |
Dispensing |
1. High thermal conductivity 2. High bonding strength 3. High reliability and excellent operability |
|
HP-E205 |
Epoxy Black Underfill for CSP and BGA Applications |
Dispensing |
1. High thermal conductivity 2. High bonding strength 3. Excellent operability |
|
HP-G030A |
Conductive Adhesive for LED Packaging |
Dispensing |
1. High conductivity and high bonding strength 2. High reliability, low halogen |
|
HP-020 series |
Conductive Adhesive for IC Packaging |
Dispensing |
1. Excellent weather resistance and thermal conductivity, can meet long-time operation 2. Good compatibility with various substrates |
|
HP-K039A, HP-K039B, HP-K039C |
Conductive Silver Paste for Optical Modules, Semiconductor Chip Packaging, and High-Power LED Packaging |
/ |
1. One-component 2. High conductivity and thermal conductivity 3. High bonding strength 4. High reliability and operability |
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