Mercury series integrated circuit material solutions
Classification:
Conductive silver paste for modules: HP-L102-L
Silver paste for internal electrodes of multilayer inductors: HP-2080G
Black epoxy underfill for semiconductor components: HP-E204
Conductive adhesive for LED packaging: HP-G030A
Conductive adhesive for IC packaging: HP-020 series
Key words:
Mercury series integrated circuit material solutions
Product Details
|
Model |
Product Type |
Process |
Features |
|
HP-L102 |
Conductive Silver Paste for Modules |
Dispensing |
1. Low-temperature curing 2. Suitable for high-speed dispensing equipment 3. Good adhesion to metals, chips, etc. |
|
HP-2080G |
Silver Paste for Internal Electrodes of Multilayer Inductors |
Screen Printing |
1. Low resistance, strong adhesion, good acid resistance 2. Suitable for manufacturing fine and thick conductive films |
|
HP-E204 |
Epoxy Black Underfill for Semiconductor Devices |
Dispensing |
1. High thermal conductivity 2. High bonding strength 3. High reliability and excellent operability |
|
HP-E205 |
Epoxy Black Underfill for CSP and BGA Applications |
Dispensing |
1. High thermal conductivity 2. High bonding strength 3. Excellent operability |
|
HP-G030A |
Conductive Adhesive for LED Packaging |
Dispensing |
1. High conductivity and high bonding strength 2. High reliability, low halogen |
|
HP-020 series |
Conductive Adhesive for IC Packaging |
Dispensing |
1. Excellent weather resistance and thermal conductivity, can meet long-time operation 2. Good compatibility with various substrates |
|
HP-K039A, HP-K039B, HP-K039C |
Conductive Silver Paste for Optical Modules, Semiconductor Chip Packaging, and High-Power LED Packaging |
/ |
1. One-component 2. High conductivity and thermal conductivity 3. High bonding strength 4. High reliability and operability |
As an innovator in the field of precious metal materials, Hyperion Tech Co.,Ltd is mainly engaged in the R & D, production and sales of high-performance electronic paste, electronic adhesive and electronic ink. Its products are mainly used in flexible circuit/display touch control, electronic components, semiconductor packaging, communication and innovative materials.
The company is committed to providing advanced, fast and high-quality precious metal material solutions for large customers in the pan-semiconductor field. It has reached in-depth cooperation with dozens of leading customers at home and abroad, and has successively obtained a number of domestic first-line chips and semiconductor industry funds. At present, Helium Technology has become one of the technological innovation companies with strong technical strength and rapid development in the domestic new material field.
The R & D center and production base are located in Zhuhai Xiangzhou High-tech Zone. It has a 3000-square-meter clean production workshop of 1,000 to 100 levels, and has established an independent production system and independent quality standard management principles.
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1338, Floor 12, Building 1, Yard 2, Boxing 9th Road, Beijing Economic and Technological Development Zone, Beijing
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