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Semiconductor sintered silver

Classification:

Summary: The HP-K039 series is a single-component, low-temperature sintering nano-conductive adhesive with ultra-high electrical and thermal conductivity; it can operate normally at low-temperature sintering and high-temperature (600℃) environments.

Key words:

Semiconductor sintered silver

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Product Details


Product Overview

The HP-K039 series is a single-component, low-temperature sintered nano-conductive adhesive with ultra-high electrical and thermal conductivity; it works normally in low-temperature sintering and high-temperature (600℃) environments; it has high bonding strength and good fatigue resistance; its composition is halogen-free and contains no organic residues; it features simple process operation and high cost performance, and is widely used in new energy vehicle power modules, optoelectronic devices, and other fields requiring high thermal and electrical conductivity.

Model

HP-K039A

HP-K039B

Competitor (H)

Appearance

Silver gray

Silver gray

Silver gray

Viscosity (cps)

16500

13500

20000

Thermal Conductivity (W/mK)

200

100

180

Volume Resistivity (μΩ.cm)

3 .0

8 .0

4 .0

Shear Strength (2*2mm, kgf/mm²)

>35

>35

>8

Curing Conditions

200℃, 1h

200℃, 1h

200℃, 1h

Product Application Cases

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