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Silver paste for chip resistors

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Silver paste for chip resistors

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Product Details


Main Indicators Back Silver Paste

Front Silver Paste

Viscosity/Pa ·S

150-200

250-350

(Viscosity measurement using BYK-Gardner Viscometer #14, 10RPM, 25℃)

Silver Content

30%-40%

70±2%

Sintered Film Thickness/μm

1.5-4.5

8.0-12.0

Substrate

95% Alumina

Printing Process

200-400 mesh polyester net

Surface Drying Process

850℃/8-10min

Sintering Process

100-200℃/5-10min

Acid Resistance Requirement

Acid resistance required (Electroplating process required)

Brightness Requirement

Requirement not high

Requirement not high

Dry Adhesion

>4B

Adhesion after sintering

≥20N/mm 2

≥20Nmm2

Sheet Resistance

≤25mΩ/□/3-5μm

≤7mΩ/□/8-10μm

TCR

 

>1000

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