Conductive adhesive for LED packaging
Classification:
Key words:
Conductive adhesive for LED packaging
Product Details
Product Overview
HP-K039D is a RoHS-compliant LED conductive die-attach adhesive with high conductivity. This product exhibits excellent adhesion to metals and silicon chips and is widely used in LED chip bonding.
Application Areas
LED Die Bonding
Features and Advantages
High Reliability, Low Halogen
Technical Challenges
Balancing Bonding Strength and Conductivity
Ensuring Stable Product Reliability
Product Performance Parameters
|
|
Item |
Performance Parameters |
Test Method |
| Basic Parameters |
Appearance |
Silver-gray fluid |
Visual Inspection |
| Viscosity |
8000±1000cps |
VT-Brookfield CP51@5rpm, 25 ℃ |
|
| Suitable Size |
≥ 3×3mil 2 |
|
|
| Performance Parameters |
Thixotropy Index |
>5.0 |
0.5 rpm viscosity / 5 rpm viscosity |
| Tg |
>120℃ |
TMA Penetration Mode |
|
| Coefficient of Thermal Expansion |
Below Tg 40 ppm/℃ |
TMA Expansion Mode |
|
| Volume Resistivity |
<3×10 -6 Ω•m |
Four-Point Probe Tester |
|
| Thermal Conductivity |
3.8 W/m.k |
/ |
|
| Weight Loss on Heating |
<5.5% |
Oven (200℃) |
Message
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Electronic E-mail
Service Hotline
Enterprise Location
1338, Floor 12, Building 1, Yard 2, Boxing 9th Road, Beijing Economic and Technological Development Zone, Beijing
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