Thick-film paste
Classification:
Key words:
Thick-film paste
Product Details
This product is suitable for thick-film circuits and chip resistors, and is commonly used in conjunction with GCE401 paste to protect substrates, base coatings, and printed circuits.
This glaze layer increases insulation resistance and enhances the weathering performance of precious metals, enabling stable operation for extended periods even in environments up to 500°C—perfectly meeting the demands of high-power electrical assembly applications.
| Product Information |
||
| Product Name |
Thick-film circuit resistor paste |
|
| Product Model |
HP301 |
|
| Physical Properties |
Sheet resistance: |
100 mΩ/□ |
| LTCR: |
650 ppm/°C |
|
| HTCR: |
490 ppm/°C |
|
| Viscosity: |
100-200Pa.s |
|
| Printing conditions: |
Screen printing on 200–250 mesh |
|
| Leveling: |
5–15 minutes at room temperature |
|
| Baking: |
Bake in a ventilated oven at 100–150°C for 10–15 minutes. |
|
| Sintering |
Sinter at 850±2°C for 9–11 minutes under an air atmosphere in a tunnel furnace. |
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