Single-component epoxy adhesive
Classification:
Key words:
Single-component epoxy adhesive
Product Details
Product Overview
One-component epoxy thermosetting adhesive with fast curing speed, low curing temperature, strong adhesion, and excellent weather resistance. The tensile strength after curing can reach more than 150N. This product is suitable for bonding and fixing PCB, PMMA, ABS, metal, glass, etc.
Application Diagram
Specifications
| Product Name |
Product Model |
Product Application |
Product Features |
Color |
Curing Conditions |
Viscosity (25℃, mPa.s) |
Color (Adjustable) |
| Bottom Fill Adhesive |
E204 Series |
Chip Packaging, Underfill |
Good fluidity, strong adhesion, fast curing speed, repairable |
White/Black |
70℃-120° ℃/30-5min |
500-10000 |
55-85 Shore D |
| Low Temperature Thermosetting Adhesive |
D101 Series |
LED backlight PCB and lens bonding |
Fast low-temperature curing, excellent weather resistance, strong adhesion |
White/Black |
70℃-90℃/10-5min |
10000-150000 |
70-85 Shore D |
| Thermosetting Adhesive |
D101A Series |
Camera module and electronic component bonding |
Fast low-temperature curing, strong adhesion, wide range of applications |
Colorless/White/Black |
70℃-120℃/30-5min |
500-20000 |
55-85 Shore D |
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1338, Floor 12, Building 1, Yard 2, Boxing 9th Road, Beijing Economic and Technological Development Zone, Beijing
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