Venus Series: Electronic Chemical Materials for LCM Modules/LED Chips
Classification:
Conductive silver paste for LED die bonding: HP-L080
Conductive silver paste for LCM display: HP-L070
Insulating adhesive for LED chip die bonding: HP-E304
Key words:
Venus Series: Electronic Chemical Materials for LCM Modules/LED Chips
Product Details
Model | Product Type | Process | Features |
HP-L080 | LED Chip Bonding Conductive Silver Paste | Dispensing | 1. High reliability, long-term use without dead lights 2. High thixotropy, suitable for high-speed dispensing 3. No tailing, no drawing, strong operability |
HP-L070 | Conductive Silver Paste for LCM Display | Dispensing | 1. One-component, natural air drying curing, low-temperature storage 2. EFD syringe packaging, suitable for fully automatic dispensing machines 3. Good conductivity, ultra-low surface resistance |
HP-E304 | LED Chip Bonding Insulating Adhesive | Syringe dispensing, molding and needle dispensing | 1. Good thermal conductivity 2. High bonding strength 3. Excellent operability |
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