Mercury Series: Material Solutions for Integrated Circuits (IC)
Classification:
Conductive silver paste for modules: HP-L102-L
Silver paste for internal electrodes of multilayer inductors: HP-2080G
Black epoxy underfill for semiconductor components: HP-E204
Conductive adhesive for LED packaging: HP-G030A
Conductive adhesive for IC packaging: HP-020 series
Keywords:
Mercury Series: Material Solutions for Integrated Circuits (IC)
Product Details
Model | Product Type | Process | Features |
HP-L102 | Conductive Silver Paste for Modules | Dispensing | 1. Low-temperature curing 2. Suitable for high-speed dispensing equipment 3. Good adhesion to metals, chips, etc. |
HP-2080G | Silver Paste for Internal Electrodes of Multilayer Inductors | Screen Printing | 1. Low resistance, strong adhesion, good acid resistance 2. Suitable for manufacturing fine and thick conductive films |
HP-E204 | Epoxy Black Underfill for Semiconductor Devices | Dispensing | 1. High thermal conductivity 2. High bonding strength 3. High reliability and excellent operability |
HP-E205 | Epoxy Black Underfill for CSP and BGA Applications | Dispensing | 1. High thermal conductivity 2. High bonding strength 3. Excellent operability |
HP-G030A | Conductive Adhesive for LED Packaging | Dispensing | 1. High conductivity and high bonding strength 2. High reliability, low halogen |
HP-020 series | Conductive Adhesive for IC Packaging | Dispensing | 1. Excellent weather resistance and thermal conductivity, can meet long-time operation 2. Good compatibility with various substrates |
HP-K039A, HP-K039B, HP-K039C | Conductive Silver Paste for Optical Modules, Semiconductor Chip Packaging, and High-Power LED Packaging | / | 1. One-component 2. High conductivity and thermal conductivity 3. High bonding strength 4. High reliability and operability |
Message
If you have any suggestions, please leave a message or send an email to us, and we will reply to you within 1 working day after receiving the message email.
Electronic E-mail
Service Hotline
Enterprise Location
1338, Floor 12, Building 1, Yard 2, Boxing 9th Road, Beijing Economic and Technological Development Zone, Beijing
Please leave your contact information to us and we will contact you within 24 hours.