Electrically Conductive Adhesive for Semiconductor Packaging
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Electrically Conductive Adhesive for Semiconductor Packaging
Product Details
Product Overview
The HP-020 series is a series of conductive adhesives with excellent weather resistance and thermal conductivity, and a long working time, using thermosetting polymers as the binder. Suitable for conductive bonding of hardware products such as IC packaging, it requires low-temperature storage and is processed using dispensing.
Model | HP-020A | HP-020D | HP-020E | HP-020B | HP-020F | HP-020C |
Appearance | Silver Gray | Silver Gray | Silver Gray | Silver Gray | Silver Gray | Silver Gray |
Viscosity (cps) | 9000 | 9000 | 11000 | 9000 | 15000 | 16000 |
Thixotropy Index | 4.5 | 5.6 | 5.0 | 4.6 | 3.0 | 5.4 |
Thermal Conductivity (W/mK) | 2.1 | 2.6 | 2.6 | 2.7 | 2.0 | 2.1 |
Volume Resistivity (Ω.cm) | 1.0×10 -4 | 1.0×10 -4 | 5.0×10 -3 | 1.0×10 -4 | 1.0×10 -4 | 8.0×10 -5 |
Working Time | 24h | 24h | 24h | 24h | 24h | 24h |
Curing Conditions (175℃) | 1h | 1h | 2h @150℃ | 15min | 1h | 1h |
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