Silver Sintering Paste for Semiconductor Packaging
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Silver Sintering Paste for Semiconductor Packaging
Product Details
Product Overview
The HP-K039 series is a single-component, low-temperature sintered nano-conductive adhesive with ultra-high electrical and thermal conductivity; it works normally in low-temperature sintering and high-temperature (600℃) environments; it has high bonding strength and good fatigue resistance; its composition is halogen-free and contains no organic residues; it features simple process operation and high cost performance, and is widely used in new energy vehicle power modules, optoelectronic devices, and other fields requiring high thermal and electrical conductivity.
Model | HP-K039A | HP-K039B | Competitor (H) |
Appearance | Silver gray | Silver gray | Silver gray |
Viscosity (cps) | 16500 | 13500 | 20000 |
Thermal Conductivity (W/mK) | 200 | 100 | 180 |
Volume Resistivity (μΩ.cm) | 3 .0 | 8 .0 | 4 .0 |
Shear Strength (2*2mm, kgf/mm²) | >35 | >35 | >8 |
Curing Conditions | 200℃, 1h | 200℃, 1h | 200℃, 1h |
Product Application Cases
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