Insulating Die-Bonding Adhesive for LED Packaging
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Insulating Die-Bonding Adhesive for LED Packaging
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Product Overview
HP-E304 is the latest generation of advanced, anti-yellowing, single-component encapsulant designed for LED chip die bonding using silicone-modified epoxy resin. It features excellent optical properties, ultra-long stable working life, fast curing ability, excellent anti-light decay ability, and excellent wire bonding temperature stability, which can greatly improve product yield. Its suitable rheological properties make it suitable for syringe dispensing, molding, and needle dispensing processes.
| Project | Performance Parameters | Test Methods |
Basic Parameters | Appearance | Transparent fluid | Visual inspection |
Viscosity | 12000mPa.s | VT-Brookfield CP51@5rpm, 25℃ | |
Curing Conditions | 120℃/30 min | Oven | |
Performance Parameters | Tensile Strength | 9MPa | @25℃ |
Tensile Elongation at Break | 4% | @25℃ | |
Coefficient of Thermal Expansion | 92ppm/K | 20-120℃ | |
Thermal Conductivity | 0.1w/m.k | @25℃ | |
Breakdown Voltage | 16KV/mm | @25℃ |
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